Welcome Letter

It is our great honor to welcome you to the 2020 International Conference on High Performance Big Data and Intelligent Systems (HPBD&IS 2020). HPBD&IS provides a premier venue for the presentation and discussion of research in the design, development, deployment and evaluation of high performance computing, big data and artificial intelligence. HPBD&IS brings together academic researchers and industrial practitioners to share and exchange the latest developments in the area of HPBD&IS. We invites participants to present and discuss their experiences in design, development, deployment and evaluation of big data and intelligent systems. The conference features a dynamic program incorporating a range of technical and industrial related keynote speakers, oral and poster presentations along with demonstrations and technical exhibits. We warmly invite you, scientists, engineers, graduate students, or anyone interested in the area, to take part in this unique and timely conference with your enthusiasm to develop, your desire to apply, and your willingness to mature the High Performance, Big Data and Artificial Intelligence technique and their applications.

Organizers



Technology Sponsors



Sponsors






2019 International Conference on High Performance Big Data and Intelligent Systems

HPBD&IS 2019 was successfully held in Longgang, Shenzhen, bringing together the world's top experts, scholars and outstanding talents in the industry, and conducting open discussions around international hot topics, core key technologies, industrial development and challenges.


Committees

General Chair:

  • Xian-He Sun, Illinois Institute of Technology, USA.
  • Geoffrey Fox, Indiana University, USA.

Program Chair:

  • Cheng-Zhong Xu, University of Macau, China.
  • Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd., China.

Publication Chair:

  • Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.

Local Organizing Co-Chairs:

  • Minggao Ma, Shenzhen Longgang District CPPCC, China.
  • Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China.
  • Lina Yu, Institute of Semiconductors, Chinese Academy of Sciences, China.

Financial Chair:

  • Xiang Li, Shenzhen International Robot City Industrial Park, Shenzhen Longgang District Robot association, China.

Steering Committee:

  • Haibo He, University of Rhode Island, USA.
  • Hong Jiang, University of Texas, Arlington, USA.
  • Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd., China.
  • Ahmed Louri, George Washington University, USA.
  • Xian-He Sun, Illinois Institute of Technology, USA.
  • Yuan Xie, University of California, Santa Barbara, USA.
  • Cheng-Zhong Xu, University of Macau, China.
  • Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA.

Technical Program Committee:

  • Pengjun Wang, College of Electrical and Electronic Engineering, Wenzhou University, China.
  • Dong An, China Agricultural University, China.
  • Xiao Bai, Beihang University, China.
  • Weiqun Cao, Beijing Forestry University, China.
  • Xu Chen, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Jian Cheng, Institute of Automation, Chinese Academy of Sciences, China.
  • Xiaoxin Cui, Peking University, China.
  • Haojiang Deng, The Institute of Acoustics of the Chinese Academy of Sciences, China.
  • Xinghao Ding, Xiamen University, China.
  • Xiaoli Dong, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Hong Jiang, University of Texas, Arlington, USA.
  • Song Jiang, University of Texas at Arlington, USA.
  • Keke Gai, Beijing Institute of Technology, China.
  • Zhiguo Gong, University of Macau, China.
  • Donghui Guo, Xiamen University, China.
  • Song Guo, The Hong Kong Polytechnic University, China.
  • Haibo He, University of Rhode Island, USA.
  • Shuibing He, University of Wuhan, China.
  • Xubin He, Temple University, USA.
  • Weijun Li, Institute of Semiconductors, Chinese Academy of Sciences, Shenzhen DAPU Microelectronics Co., Ltd., China.
  • Sheng Li, Zhongnan University of Economics and Law, China.
  • Fang Liu, Sun Yat-sen University, China.
  • Yan Liu, Huaqiao University, China.
  • Yuhong Liu, Santa Clara University, USA.
  • Ahmed Louri, George Washington University, USA.
  • Wei Meng, Beijing Forestry University, China.
  • Xin Ning, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Hong Qin, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Jianlong Qiu, Linyi University, China.
  • Rongxuan Shen, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Jiwu Shu, Tsinghua University, China.
  • Xian-He Sun, Illinois Institute of Technology, USA.
  • Bo Tang, Mississippi State University, USA.
  • Yufei Tang, Florida Atlantic University, USA.
  • Donghui Wang, The Institute of Acoustics of the Chinese Academy of Sciences, China.
  • Jianping Wang, City University of Hong Kong, China.
  • Lin Wang, Xiamen University, China.
  • Yang Wang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.
  • Fei Wu, Huazhong University of Science and Technology, China.
  • Nong Xiao, National University of Defense Technology, China.
  • Wan'ang Xiao, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Xiaodong Xie, Huaqiao University, China.
  • Yuan Xie, University of California, Santa Barbara, USA.
  • Cheng-Zhong Xu, University of Macau, China.
  • Jian Xu, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Feng Yan, University of Nevada, Reno, USA.
  • Jun Yan, Concordia University, Canada.
  • Guowei Yang, Nanjing Audit University, Qingdao University, China.
  • Huihua Yang, BeijingUniversity of Posts and Telecommunications, China.
  • Qing Yang, University of Rhode Island, Shenzhen DAPU Microelectronics Co., Ltd., USA.
  • Kejiang Ye, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.
  • Jun Yi, Chongqing University of Science and Technology, China.
  • Liping Zhang, Institute of Semiconductors, Chinese Academy of Sciences, China.
  • Xiaorong Zhang, California State University. SF., USA.
  • Ke Zhou, Huazhong University of Science and Technology, China.
  • Dazhou Zhu, Institute of Food and Nutrition Development, Ministry of Agriculture and Rural Affairs, China.
  • Chao Li, Shanghai Jiao Tong University, China.
  • Fengwei ZHANG, Shanghai Jiao Tong University, China.
  • Zichen Xu, Nanchang University, China.

Web Co-Chairs:

  • Shilin Zhao, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.
  • Shujian Ji, Southern University of Science and Technology, China.
  • Yongzhong Sun, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, China.

Call for Papers

Call for Papers [Main Conference]: PDF Version is Available Here.

Topics of interest include, but are not limited to:


1.High Performance Computing Technology and Its Applications

  • High Performance Computer System Software
  • High Performance Computer Architecture
  • High Performance Computing Environments
  • High Performance Micro Processor
  • High Performance Storage Technology
  • Multi-Core and Multi-Threaded Architecture Methods
  • Architecture, Software and Algorithm of Parallel and Distributed System
  • High Performance Ubiquitous Computing
  • High Performance Adaptive and Evolutionary Computing
  • High Performance Application
  • Parallel Processing of Big Data

2.Big Data Technology and Its Applications

  • Big Data Model, Processing Algorithm and Programming Technology
  • Representation of Multimedia Big Data
  • Big Data Analytics and Metrics
  • Big Data Durability and Storage
  • Big Data Quality and Source Control
  • Big Data Protection Integrity and Privacy
  • Big Data Storage and Computing Fusion Technology
  • Big Data Search and Mining
  • Big Data Visual Analysis
  • Big Data Business Model Innovation
  • Big Data Security Application

3.Intelligent Systems

  • Neural Network and Learning Systems
  • Computer Vision
  • Machine Art
  • Robotic Science and Control Engineering
  • Smart Sensor and Sensor Fusion
  • Intelligent Storage Device and System
  • Real Time Surveillance
  • BlockChain
  • Adaptive Surveillance System
  • Virtual System
  • Complex Systems and Networks
  • Intelligent Manufacturing

Papers on other topics in related subject areas are also welcome.


Submission of Full Papers

Please submit the full paper before the deadline of Jan 19, 2020. All papers, both invited and contributed, will be reviewed by three experts. After a careful review process, all accepted papers will be published in the conference proceedings of HPBD&IS 2020. The proceedings will be published by IEEE Xplore® , and indexed by EI

Please prepare your full paper according to the Manuscript Templates for Conference Proceedings, it can be found at: https://www.ieee.org/conferences_events/conferences/publishing/templates.html.

All final submissions should be written in English with a maximum paper length of six (6) printed pages  (including figures, tables, and references). Please submit Microsoft Word .docx(strongly preferred) or .doc files.

Please click here https://easychair.org/conferences/?conf=hpbdis2020 to submit abstract and full papers for HPBD&IS 2020.

Importants Dates:

Abstract submission date:

12 Jan 2020

Full paper submission date:

19 Jan 2020

Notification of acceptance date:

19 Feb 2020

Final paper submission date:

13 Apr 2020


Accommodation

HPBD&IS 2020 will be held at the Friends International Hotel Shenzhen.The local organizing committee has negotiated a preferential rate for the rooms.
If you want to know much about the hotel, you can visit the website:http://www.tanglahotelshenzhen.com


Address: No. 588 Jixiang Middle Road, Central Town, Longgang District, Shenzhen, China
Tel: (86) 400 862 8088(Coupon Code:11447)
Tel: (86) 008620-8600 9099
Fax: (86) 0755-89988888

Transportation

The hotel is located 1.5km away from exit D of Jixiang subway station on line 3. Airport bus 330B goes directly to the lobby of the hotel, and you can walk to the scenic Longtan Park.

【To the hotel】:

- 53.9 km from Shenzhen Baoan International Airport, about 50 minutes by taxi;
- 29.7km from Shenzhen railway station, about 40 minutes by taxi;
- 900 meters from Longgang bus terminal, about 15 minutes walk;
- 2.1km from Jixiang station of Metro Line 3, about 5 minutes by taxi.

【Information around the hotel】:

- To Longtan Park, about 5 minutes walk;
- 800 meters from Tianhong shopping mall, about 15 minutes walk;
- 1.2km from the world trade center, about 15-20 minutes walk;
- 1.5km from Longgang District government, about 5 minutes by taxi;
- It is 30.9 kilometers from the north of Huaqiang and about 44 minutes by taxi;
- It is about 28.5km from Dongmen pedestrian street and about 53 minutes by taxi.


Contact Us

Conference Secretary:

Jinxia Zhang
Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences
Shenzhen, China
Tel: +86-0755-86392356   
Phone: +86-18588220505
E-mail: zhangjx@siat.ac.cn

Lina Yu
Institute of Semiconductors, Chinese Academy of Sciences
Beijing, China
Tel: +86-10-82304544   
Phone: +86-15810374339
E-mail: hpbdis@semi.ac.cn